Systems and methods for coupling electrically isolated sections of an electronic device

ABSTRACT

Each knuckle is molded in and/or around a coupling structure that is either welded to or is an integral part of the section. The coupling structure can be a bracket that is welded to an inner surface of a section, and the bracket is constructed to have a cross-section that minimizes capacitance. In one embodiment, a first bracket can be welded to a first conductive section, and a second bracket can be welded to a second conductive section. A knuckle constructed from an insulating material that is overmolded within and around the first and second brackets such that the first and second conductive sections are coupled together. The first and second conductive sections and their respective brackets are spaced a predetermined distanced apart, thereby ensuring the conductive sections are electrically isolated.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation patent application of U.S. patentapplication Ser. No. 13/251,039, filed Sep. 30, 2011 and titled “Systemsand Methods for Coupling Electrically Isolated Sections of an ElectronicDevice,” which claims the benefit of U.S. provisional patent applicationNo. 61/529,710, filed Aug. 31, 2011 and titled “Systems and Methods forCoupling Electrically Isolated Sections of an Electronic Device,” thedisclosures of which are hereby incorporated by reference herein intheir entireties.

FIELD OF THE INVENTION

Systems and methods are disclosed for coupling sections of an electronicdevice. In particular, components of an electronic device can beassembled from two or more sections, where these sections may be coupledtogether using knuckles.

BACKGROUND OF THE DISCLOSURE

A portable electronic device can be constructed using differentapproaches. In some cases, an electronic device can be constructed byassembling several components together. These “components” can includeexternal components that are combined to form a device enclosure (e.g.,a device “housing”), as well as internal components that may providestructural support or other functionality for the electronic device(e.g., the internal component could be a microchip). Based on the designof the electronic device, the components can be formed from any suitablematerial(s) such as metals, plastics, or any other materials.

In some cases, the various components of the electronic device canoperate as part of an electrical circuit. For example, a particularcomponent could serve as a resistor or as a capacitor to another part ofthe electronic device. As another example, a component can function aspart of an antenna assembly of the electronic device. If the componentis used in only a single electrical circuit, then the component may beconstructed from a single piece of conductive material. If the samecomponent, however, is used in several different electrical circuits,the component may need to be constructed from several “sections” ofconductive elements. In this case, however, it may be necessary toseparate each of the conductive sections with an insulating or othernon-conductive material, in order to ensure that each section operatesin its own electrical circuit correctly.

SUMMARY OF THE DISCLOSURE

This is directed to systems and methods for coupling sections of anelectronic device. In some embodiments, an electronic device can beformed from several components, such as an outer periphery componentand/or other components. The outer periphery component may provide ahousing structure for the electronic device by encircling the electronicdevice. In some cases, this outer periphery component can be assembledfrom two or more “sections.” Knuckles may then be used to couple thesesections together.

Each knuckle is molded in and/or around a coupling structure that iseither welded to or is an integral part of the section. The couplingstructure can be a bracket that is welded to an inner surface of asection, and the bracket can be constructed to have a cross-section thatminimizes capacitance. In one embodiment, a first bracket can be weldedto a first conductive section, and a second bracket can be welded to asecond conductive section. A knuckle constructed from an insulatingmaterial that is overmolded within and around the first and secondbrackets such that the first and second conductive sections are coupledtogether. The first and second conductive sections and their respectivebrackets are spaced a predetermined distanced apart, thereby ensuringthe conductive sections are electrically isolated. In anotherembodiment, a knuckle can physically couple two conductive sectionstogether by interfacing with a bracket of a first conductive section andby interfacing with an integral coupling structure of a secondconductive section.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present invention, its nature andvarious advantages will be more apparent upon consideration of thefollowing detailed description, taken in conjunction with theaccompanying drawings in which:

FIG. 1 shows a schematic view of an illustrative component of anelectronic device in accordance with some embodiments of the presentinvention;

FIGS. 2A-G show several views of an illustrative bracket in accordancewith some embodiments of the invention;

FIGS. 2H-2N show several views of another illustrative bracket inaccordance with some embodiments of the invention;

FIGS. 3A and 3B show illustrative views of a bracket welded to a sectionin accordance with some embodiments of the invention;

FIG. 4 shows an illustrative view of another bracket welded to a sectionin accordance with some embodiments of the invention;

FIGS. 5A and 5B show various views of a particular knuckle design inaccordance with one embodiment of the invention;

FIGS. 6A-6C show various schematic views of another particular knuckledesign in accordance with one embodiment of the invention;

FIG. 7 shows a cross-sectional view of the knuckle of FIG. 6A inaccordance with one embodiment of the invention;

FIGS. 8A-8C show various schematic views of yet another particularknuckle design in accordance with one embodiment of the invention; and

FIG. 9 shows an illustrative process for mechanically coupling twosections together in accordance with some embodiments of the invention.

DETAILED DESCRIPTION OF THE DISCLOSURE

An electronic device can include several components assembled togetherto form internal and/or external features of the electronic device. Forexample, one or more internal components (e.g., electrical circuitryand/or internal support structures) can be placed within externalcomponents (e.g., housing structures) to provide an electronic devicehaving desired functionality. As used herein, the term “component”refers to a distinct entity of an electronic device, such as aparticular electronic circuit (e.g., a microchip), a member forming thehousing of the electronic device (e.g., a backplate, an outer peripherycomponent, and the like), an internal support structure (e.g., amid-plate), and the like.

In some cases, a component can be manufactured by assembling andconnecting two or more different individual elements (i.e., “sections”)together. As used herein, the term “section” refers to an individualportion of a component, where that component may be formed from multiplesections. The various sections of the component may then be coupledtogether using a “knuckle.” Based on the desired functionality anddesign of the component and its sections, these knuckles can exhibit awide range of shapes and structures. For example, the knuckles caninclude structural designs that reinforce the knuckle at areas of highmechanical strain, that counteract twisting movements at areas of hightorsion, that interlock two sections together such that they aremechanically coupled together, that provide electrical isolation betweenthe sections, and the like.

FIG. 1 shows a schematic view of an illustrative component of anelectronic device in accordance with some embodiments of the presentinvention. In particular, FIG. 1 shows outer periphery component 100that can be constructed by connecting several sections together, such assections 110, 120, 130, and 140. Outer periphery component 100 can beconstructed to form an exterior, periphery surface for an electronicdevice. In particular, outer periphery component 100 can surround orwrap around some or all of the internal components (e.g., electroniccircuits, internal support structures, and the like) of the electronicdevice. In other words, outer periphery component 100 can define aninternal volume into which internal components can be placed.

The thickness, length, height, and cross-section of outer peripherycomponent 100 can be selected based on any suitable criteria including,for example, based on structural requirements (e.g., stiffness orresistance to bending, compression, tension or torsion in particularorientations). In some embodiments, outer periphery component 100 canserve as a structural member to which other electronic device componentscan be mounted. Some of the structural integrity of outer peripherycomponent 100 can come from the closed shape that it defines (e.g.,outer periphery component 100 forms a loop, thus providing structuralintegrity).

Outer periphery component 100 can have any suitably shapedcross-section. For example, outer periphery component 100 can have asubstantially rectangular cross-section. Each corner of thesubstantially rectangular cross-section can be rounded in shape, thusforming a “spline.” As used herein, the term “spline” refers to arounded corner portion of an outer periphery component. In someembodiments, outer periphery component 100 can have a cross-section inany other suitable shape including, for example, a circular shape, anoval shape, a polygonal shape, or a curved shape. In some embodiments,the shape or size of the cross-section of outer periphery component 100can vary along the length or width of the electronic device (e.g., anhourglass shaped cross-section).

Outer periphery component 100 of the electronic device can beconstructed using any suitable process. In some embodiments, outerperiphery component 100 can be constructed by connecting section 110 andsection 120 together at interface 112, connecting section 120 andsection 130 together at interface 122, connecting section 130 andsection 140 together at interface 132, and connecting section 140 andsection 110 together at interface 142. Although outer peripherycomponent 100 is illustrated in FIG. 1 as being constructed from foursections, one skilled in the art could appreciate that outer peripherycomponent 100 could alternatively be formed from any suitable number oftwo or more sections, and that the interfaces between the sections maybe positioned at any location on outer periphery component 100.

Each section 110, 120, 130, and 140 can be constructed individually andlater assembled to form outer periphery component 100. For example, eachsection can be individually constructed using one or more of stamping,machining, working, casting, or any combinations of these. In someembodiments, the materials selected for sections 110, 120, 130, and 140can be conductive, thus allowing the sections to provide an electricalfunctionality for the electronic device. For example, sections 110, 120,130 and/or 140 can be formed from a conductive material such asstainless steel or aluminum. In some embodiments, each section may serveas an antenna for the electronic device.

To mechanically couple individual sections together, knuckles 114, 124,134, and 144 can exist at interfaces 112, 122, 132, and 142respectively. In some embodiments, each of the knuckles can beconstructed from a material that can begin in a first state and maysubsequently change to a second state. As an illustration, the knucklescan be constructed from a plastic that begins in a first, liquid stateand then subsequently changes to a second, solid state. While in theliquid state, the plastic can be allowed to flow into interfaces 112,122, 132, and 142. After flowing into these interfaces, the plasticmaterial may subsequently be allowed to harden into knuckles 114, 124,134, and 144 (e.g., the plastic material is allowed to change into thesecond, solid state). Upon changing into the solid state, the plasticmaterial may then bond together sections 110 and 120, 120 and 130, and140 and 110, respectively, thus forming a single new component (e.g.,outer periphery component 100). In one embodiment, knuckle 134 may becosmetic and not physically couple sections 130 and 140 together. Inthis embodiment, sections 130 and 140 can be welded together so thatthey are physically and electrically coupled. In another embodiment,knuckle 134 may physically couple sections 130 and 140 together inaccordance with principles of the invention.

Knuckles 114, 124, and 144 not only physically couple together sections110 and 120, 120 and 130, and 140 and 110, respectively, theyelectrically isolate section 110 from section 120, section 120 fromsection 130, and section 140 from section 110. For purposes of thisdiscussion, assume sections 130 and 140 are electrically the samebecause they are welded together, and that knuckle 134 is cosmetic. Aswill be explained in more detail below, knuckles 114, 124, and 144encapsulate and/or exist with coupling structures that are attached toor integrally formed parts of sections 110, 120, 130, and 140. That is,when the knuckle in its first state (e.g., the liquid state), it flowsinto and/or around the coupling structures. A shutoff device (not shown)may be positioned at each interface to shape the knuckle for when ittransforms into its second state (e.g., the solid state). As shown inFIG. 1, knuckles 114 and 124 are asymmetric in shape and knuckle 144 issymmetric in shape.

The coupling structures (not shown) exist on sections 110, 120, 130, and140. Some sections (e.g., sections 110 and 120) may have two couplingstructures whereas other sections (e.g., sections 130 and 140) have onecoupling structure for interfacing with a knuckle. In some embodiments,the coupling structure can be a bracket such as that shown, for example,in FIG. 2. The bracket can be attached or welded to an inside surface ofa section. In another embodiment, the coupling structure can be anintegrally formed part of the section that was originally part of thesection. In FIG. 1, knuckle 114 interfaces with a bracket and anintegrally formed coupling structure and knuckles 124 and 144 interfacewith two brackets.

Any suitable process can be used to place the knuckle material intointerfaces 112, 122, 132, and 142, and any suitable process can be usedto change the knuckle material from the first state to the second state.In some embodiments, a “molding process” can be used in which theknuckle material is initially inserted in a liquid state and then issubsequently hardened. For example, one or more of injection molding,compression molding, transfer molding, extrusion molding, blow molding,thermoforming, vacuum forming, or rotomolding processes can be used. Inthis case, a “one shot” process can be used in which the knucklematerial is inserted in a single step, and then independently changes toits second state. In other words, the knuckle can be formed in a singlestep (e.g., in “one shot”) without necessitating additional steps ormanufacturing processes.

The knuckle material may be any material suitable for mechanicallycoupling two sections together and electrically isolate the two section.The knuckle material may be a plastic such as a thermal plastic. In oneembodiment, the knuckle material may be a glass filled nylon.

FIGS. 2A-G show several views of an illustrative bracket 200 inaccordance with an embodiment of the invention that can be mounted toone of the sections. In particular, FIGS. 2A-G show back, top, front,left, right, bottom, and isometric views respectively of bracket 200.Bracket 200 can include three legs 210, 220, and 230, which extend fromplaner member 240. Legs 210 and 220 may both extend away from planermember 240 at a right angle (e.g., 90 degrees), whereas leg 230 mayextend away from leg 230 at angle between 1 and 90 degrees. Leg 230 canhave slot 232 to promote flow of knuckle material when it is in itsfirst state. In addition, plate 240 can have through-hole 242 or acutout of any suitable shape to promote flow of knuckle material when inits first state. Legs 210, 220, and 230 may have feet 214, 224, and 234,respectively, for being welded to a surface of one of the sections.

Bracket 200 can be constructed from any suitable material. In someembodiments, bracket 200 is constructed from a conductive material suchas metal (e.g., steel or aluminum). In some embodiments, bracket 200 isconstructed from the same material as the section it is being welded to.For example, bracket 200 and the section it is being welded to can bothbe constructed from stainless steel.

It is understood that brackets of any suitable construction can be usedin connection with the sections. For example, FIGS. 2H-2N shows severalviews of bracket 250 constructed in accordance with an embodiment of theinvention. Bracket 250 is similar in many respects to bracket 200 as itincludes legs and welding feet, as well as a cutout for promotingknuckle material flow. However, bracket 250 may be dimensioned slightlysmaller than bracket 200, for example, to better fit in a curved portionof a section.

Referring now to FIGS. 3A and 3B, illustrative views of bracket 200welded to section 300 are shown. In particular, FIG. 3A shows anillustrative cross-sectional view and FIG. 3B shows an illustrative topview. Bracket 200 is shown sitting within recess 310 of section 300.Recess 310 may have been machined out of section 300 during or aftermanufacture of section 300. Recess 310 may serve as a vessel forretaining a portion of a knuckle as it transitions from its first tosecond state. As shown, feet 214, 224, and 234 are welded to recess 310.This weld physically anchors bracket 200 to section 300 and electricallycouples bracket to section 300.

The edge of bracket 200 aligns with the edge of section 300. Thisalignment may be a product of a cutting operation that physically cutsaway a portion of bracket 200 and section 300. It is the totalcross-sectional area of the aligned edges of bracket 200 and section 300that control capacitance of the knuckle coupling two sections together.Smaller cross-sections generally result in less capacitance. Inembodiments where the section is used as an antenna, lower capacitanceenhances antenna performance. The cross-sectional area can be varied,for example, by increasing the thickness of bracket 200 or using abracket that has a different cross-sectional shape. See FIG. 4 as anexample of another bracket 400 having a different cross-sectional shape.

FIG. 5A shows an illustrative enlarged perspective view of sections 110and 140 (of FIG. 1) having respective brackets 200 welded thereto inaccordance with an embodiment of the invention. FIG. 5A also showscontact members 520 and 540 welded to top of the planer member of eachbracket 200. Contact members 520 and 540 have a cutout that mimicscutout 242 of bracket 200 and that promotes flow of knuckle materialwhen it is in its first state. A portion of contact members 520 and 540will be left exposed after the knuckle material encapsulates brackets200 and members 520 and 540. The exposed portion may provide a solderpad for connecting a conductor (e.g., an antenna conductor) so that itis electrically coupled to one of sections 120 or 140.

Gap 510 exists between the side walls of sections 110 and 140. Gap 510may have a predetermined distance that is maintained between the sidewalls and brackets 200 during application of the knuckle material. Whenthe material is applied, it can flow in and around brackets 200, members520 and 540, and fill the recesses in which brackets 200 sit. After thematerial cures, resulting knuckle 144 (FIG. 5B) is provided.

FIG. 5B shows a perspective view of knuckle 144 in accordance with anembodiment of the invention. As shown, knuckle 144 physically couplessections 100 and 140 together but ensures they are electrically isolatedby the distance of gap 510. Portions of contact members 520 and 540 areexposed even though knuckle 144 is cured. It is understood that contactmembers 520 and 540 are optional and are not necessary for each knuckle.For example, knuckle 124 may not encapsulate any contact members.

FIG. 6A shows a perspective view of knuckle 124 of FIG. 1 in accordancewith an embodiment of the invention. Knuckle 124 can encapsulate twobrackets (not shown) and mechanically couple sections 120 and 130together, and ensures they are electrically isolated by gap 710. FIGS.6B and 6C show a perspective view and a top view, respectively ofbrackets 200 and 250 mounted to sections 120 and 130, respectively.Bracket 250 is dimensioned a little smaller than its counterpart bracket200 and thus may be better suited for being mounted in curved sections,such as section 120.

FIG. 7 shows a cross-sectional view taken along line A-A of FIG. 6A. Thecross-sectional view shows side wall 732 of section 130, knuckle 124,and bracket 200. Also shown is vertical center axis 701 which is alignedwith plate member 240. Horizontal center axis 702 is also shown tobisect plate member 240. Equal thicknesses of knuckle 124 exist on bothsides of center axes 701 and 702. This ensures knuckle 124 is evendistributed about the bracket and provides optimal mechanical couplingstrength.

FIGS. 8A-C show various illustrative views of interface 112 inaccordance with embodiments of the invention. FIG. 8A shows bracket 250mounted to section 120 and it also shows integrated coupling structure850. FIGS. 8B and 8C show knuckle 114 interfacing with bracket 250 andcoupling structure 850.

FIG. 9 shows an illustrative process for mechanically coupling twoconductive sections together in accordance with an embodiment of theinvention. Beginning at step 910 first and second conductive sectionsare provided. The conductive sections each have an inner surface and aside wall. For example, the conductive sections can be sections 110 and120 of FIG. 1. The sections are discrete components that have beenpreviously machined or manufactured. If desired, a recess can bemachined out of a portion of each section, and in particular a portionof the inner surface.

At step 920, a first bracket is welded to the inner surface of the firstconductive section and a second bracket welded to the inner surface ofthe second conductive section. The brackets can be seen in FIG. 2, forexample. The welds physically and electrically couple the brackets totheir respective sections. In some embodiments, the brackets can bewelded within a recess of the section. In other embodiments, contactmembers (e.g., as shown in FIG. 5) may be welded to the brackets.

At step 930, the first and second sections are secured in place and agap of a predetermined distance is machined between the two sections.The machining precisely cuts away a portion of each section and aportion of the brackets, and in some embodiments, may cut away a portionof the contact member if present. The resulting gap is maintainedbecause the sections are secured.

At step 940, a knuckle is molded within and around the first and secondbrackets to mechanically couple the first and second conductive sectionstogether, wherein the sidewalls of the first and second conductivesections are separated by the gap of a predetermined distance that isoccupied by a portion of the knuckle. During molding of the knuckle, ashutoff device may be applied to the sections to shape and control theflow of knuckle material. The knuckle material surrounds the bracket(and optional contact member) and fills in the recess when in its moltenor liquid state.

At step 950, a cosmetic finishing process is applied to the sections andknuckle. This process can involve trimming away a portion of the knuckleand polishing the sections to meet a desired aesthetic appeal.

It should be understood that the processes described above are merelyillustrative. Any of the steps may be removed, modified, or combined,and any additional steps may be added or steps may be performed indifferent orders, without departing from the scope of the invention.

The described embodiments of the invention are presented for the purposeof illustration and not of limitation.

What is claimed is:
 1. An electronic device, comprising: a firstconductive section having a first inner surface; a first couplingstructure extending from the first inner surface; a second conductivesection having a second inner surface; a second coupling structureextending from the second inner surface; a contact member coupled to thefirst coupling structure; an antenna circuit electrically connected tothe first conductive section via the contact member; and an insulatinginterface formed around the first and second coupling structures suchthat the first and second conductive sections are structurally coupledtogether and the first coupling structure is encapsulated by theinsulating interface, the first conductive section, and the contactmember.
 2. The electronic device of claim 1, wherein the first andsecond coupling structures are conductive.
 3. The electronic device ofclaim 1, wherein the contact member comprises a solder pad.
 4. Theelectronic device of claim 1, wherein the insulating interfaceelectrically isolates the first conductive section from the secondconductive section.
 5. The electronic device of claim 1, wherein thefirst and second coupling structures have different dimensions.
 6. Anelectronic device, comprising: a first conductive section having a firstinner surface and a first protrusion formed thereon, the firstconductive section electrically coupled to antenna circuitry; a secondconductive section having a second inner surface and a second protrusionformed thereon; and an insulating coupling section formed around thefirst and second protrusions such that the first and second conductivesections are coupled together and the first protrusion is surrounded ina plane by the insulating coupling section and the first conductivesection.
 7. The electronic device of claim 6, wherein the first andsecond conductive sections are coupled together to define a gap betweenthe first and second conductive sections.
 8. The electronic device ofclaim 7, wherein a portion of the insulating coupling section fills thegap.
 9. The electronic device of claim 6, wherein the first conductivesection and the first protrusion are formed of a same material.
 10. Theelectronic device of claim 6, wherein a portion of the insulatingcoupling section fills a portion of the first protrusion.
 11. Theelectronic device of claim 6, further comprising a third protrusionformed on the first inner surface.
 12. The electronic device of claim 6,wherein the first conductive section varies in thickness across a lengthof the first conductive section.
 13. An electronic device, comprising: afirst conductive segment having a first inner surface and a firstcoupling structure protruding therefrom, the first conductive segment isoperable as an antenna; a second conductive segment having a secondinner surface and a second coupling structure protruding therefrom; andan insulating intermediate segment molded around the first and secondcoupling structures such that the first and second conductive segmentsare joined together and the first coupling structure is encapsulated bythe insulating intermediate segment.
 14. The electronic device of claim13, wherein the first coupling structure is integrally formed with thefirst conductive segment.
 15. The electronic device of claim 13, whereinthe second coupling structure is encapsulated by the insulatingintermediate segment and the second inner surface.
 16. The electronicdevice of claim 13, wherein the first conductive segment has a firstedge, the first coupling structure has a second edge, and the first edgeis aligned with the second edge.
 17. The electronic device of claim 16,wherein a cross-sectional area of the first edge and the second edge isconfigured to control a capacitance of the insulating intermediatesegment.
 18. The electronic device of claim 16, wherein the secondconductive segment has a third edge that is parallel to the first edge.19. An electronic device, comprising: a first conductive section havinga first inner surface and a first protrusion formed thereon; a secondconductive section having a second inner surface and a second protrusionformed thereon; a third protrusion formed on the first inner surface;and an insulating coupling section formed around the first and secondprotrusions such that the first and second conductive sections arecoupled together; wherein, across a plane intersecting the insulatingcoupling section and the first conductive section, the first protrusionis surrounded by the insulating coupling section and the firstconductive section.
 20. The electronic device of claim 19, furthercomprising: a third conductive section; and an additional insulatingcoupling section that couples the third conductive section to the firstconductive section.
 21. The electronic device of claim 19, wherein theadditional insulating coupling section at least partially envelops thethird protrusion.